Memory chip

Nomor Bagian
WINBOND (Winbond)
Pabrikan
Keterangan
67657 PCS
Persediaan
Nomor Bagian
MK (Mike Foundry)
Pabrikan
SD NAND 4Gbit, SLC, industrial grade wide temperature, -40°C to +85°C; alias SMD TF card, built-in ECC check, bad block management, wear average algorithm, 10,000 abnormal power failure protection and other functions .
Keterangan
73718 PCS
Persediaan
Nomor Bagian
MICROCHIP (US Microchip)
Pabrikan
Keterangan
90458 PCS
Persediaan
micron
Pabrikan
Keterangan
61192 PCS
Persediaan
Nomor Bagian
onsemi (Ansemi)
Pabrikan
Keterangan
97591 PCS
Persediaan
Nomor Bagian
SAMSUNG (Samsung Semiconductor)
Pabrikan
Keterangan
74921 PCS
Persediaan
Nomor Bagian
MICROCHIP (US Microchip)
Pabrikan
Keterangan
84082 PCS
Persediaan
Nomor Bagian
MK (Mike Foundry)
Pabrikan
SD NAND 1Gbit, SLC, industrial-grade wide temperature, -40°C to +85°C; alias SMD TF card, SDNAND, embedded ECC check, bad block management, wear average algorithm, 10,000 abnormal power failure protection and other functions.
Keterangan
64790 PCS
Persediaan
Nomor Bagian
ST (STMicroelectronics)
Pabrikan
Keterangan
62560 PCS
Persediaan
Nomor Bagian
ATO SOLUTION
Pabrikan
Keterangan
69620 PCS
Persediaan
MICROCHIP (US Microchip)
Pabrikan
Keterangan
56071 PCS
Persediaan
Nomor Bagian
CYPRESS (Cypress)
Pabrikan
256-Kbit (32K × 8bit), I2C interface, working voltage: 2.7V to 5.5V
Keterangan
51155 PCS
Persediaan
Nomor Bagian
FMD (Hui Mang Micro)
Pabrikan
Keterangan
56143 PCS
Persediaan
Nomor Bagian
MICROCHIP (US Microchip)
Pabrikan
Keterangan
97387 PCS
Persediaan
Nomor Bagian
FM (Fudan Micro)
Pabrikan
Keterangan
54414 PCS
Persediaan
Nomor Bagian
Metorage (Spark Semiconductor)
Pabrikan
MMC eMMC 128GB TLC Industrial -25~85℃, application fields: industrial control, automotive electronics, medical
Keterangan
99656 PCS
Persediaan
Nomor Bagian
CS (Creation)
Pabrikan
Driver-free use, standard SDIO interface, compatible with SPI/SD/eMMC interface, compatible with major MCU platforms; built-in EDC/ECC, bad block management, garbage collection algorithm; can be machine-mounted, lock wafer and controller, high consistency; Built-in SLC wafer, 10W erasing and writing life, passed 10,000 random power-off tests. \n\nCS (Genesis) SD NAND is also called by many developers friends: SMD TF card, SMD SD card, SMD card, soldered SD card, soldered TF card, industrial grade TF card, Industrial grade SD card, embedded SD card, etc. It mainly solves the problem that the main control (such as STM32 series MCU MCU) needs to manage NAND FLASH by itself when using SLC NAND FLASH, SPI NAND FLASH, eMMC, etc. CS (Genesis) SD NAND can be used without drivers (so it is also called no need to write drivers NAND Flash). Compared with eMMC, CS (Genesis) SD NAND has fewer pins (convenient for soldering); smaller capacity (can help customers reduce costs); longer erasing life; smaller size (occupies only 1/3 of eMMC PCB area) ); save the number of PCB board layers (2-layer board can be used)
Keterangan
78905 PCS
Persediaan
micron
Pabrikan
Keterangan
56158 PCS
Persediaan
Nomor Bagian
MICROCHIP (US Microchip)
Pabrikan
Keterangan
61889 PCS
Persediaan
Nomor Bagian
MICROCHIP (US Microchip)
Pabrikan
Keterangan
99013 PCS
Persediaan