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XCKU3P-L2SFVB784E
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XCKU3P-L2SFVB784E

Product Overview

  • Category: Integrated Circuit (IC)
  • Use: Programmable Logic Device (PLD)
  • Characteristics: High-performance, low-power consumption
  • Package: BGA (Ball Grid Array)
  • Essence: FPGA (Field-Programmable Gate Array)
  • Packaging/Quantity: Tray, 1 piece per tray

Specifications

  • Manufacturer: Xilinx Inc.
  • Series: Kintex UltraScale+
  • Model: XCKU3P-L2SFVB784E
  • Technology: 16nm FinFET+
  • Logic Cells: 2,541,440
  • DSP Slices: 3,528
  • Block RAM: 68,400 Kb
  • Transceivers: 96
  • Operating Voltage: 0.95V - 1.05V
  • Operating Temperature: -40°C to +100°C
  • Package Dimensions: 35mm x 35mm

Detailed Pin Configuration

The XCKU3P-L2SFVB784E has a complex pin configuration with a total of 784 balls in the BGA package. The pins are arranged in a grid pattern and provide various functionalities such as power supply, clock inputs, general-purpose I/Os, and high-speed transceiver interfaces.

For a detailed pin configuration diagram, please refer to the manufacturer's datasheet.

Functional Features

  • High-performance processing capabilities
  • Flexible and reconfigurable design
  • Low-power consumption
  • Support for advanced communication protocols
  • Built-in DSP slices for signal processing
  • Large amount of block RAM for data storage
  • High-speed transceivers for fast data transfer
  • Extensive I/O options for interfacing with external devices

Advantages and Disadvantages

Advantages: - Versatile and adaptable to different applications - High processing power and performance - Low power consumption compared to alternative solutions - Support for advanced communication protocols

Disadvantages: - Complex pin configuration may require careful design considerations - Higher cost compared to some alternative models - Steeper learning curve for inexperienced users

Working Principles

The XCKU3P-L2SFVB784E is based on FPGA technology, which allows users to program the device according to their specific requirements. The FPGA consists of a large number of configurable logic blocks interconnected through programmable interconnects. These logic blocks can be programmed to implement various digital circuits, making the device highly flexible and adaptable.

The working principle involves configuring the FPGA with a bitstream file that defines the desired circuit functionality. Once programmed, the FPGA executes the circuit operations by routing signals through the configured logic blocks and interconnects.

Detailed Application Field Plans

The XCKU3P-L2SFVB784E is suitable for a wide range of applications, including but not limited to:

  1. High-performance computing systems
  2. Data center infrastructure
  3. Network routers and switches
  4. Wireless communication equipment
  5. Video processing and broadcasting
  6. Industrial automation and control systems
  7. Medical imaging and diagnostics
  8. Aerospace and defense systems

Detailed and Complete Alternative Models

  1. XCKU3P-L1SFVB784E: Similar to XCKU3P-L2SFVB784E but with fewer transceivers.
  2. XCKU3P-L2SFVB900E: Similar to XCKU3P-L2SFVB784E but with higher logic capacity.
  3. XCKU3P-L2SFVB676E: Similar to XCKU3P-L2SFVB784E but with a smaller package size.

These alternative models offer different combinations of features and specifications to cater to diverse application requirements.

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Sebutkan 10 pertanyaan dan jawaban umum terkait penerapan XCKU3P-L2SFVB784E dalam solusi teknis

Sure! Here are 10 common questions and answers related to the application of XCKU3P-L2SFVB784E in technical solutions:

  1. Question: What is the XCKU3P-L2SFVB784E?
    Answer: The XCKU3P-L2SFVB784E is a field-programmable gate array (FPGA) device manufactured by Xilinx.

  2. Question: What are the key features of the XCKU3P-L2SFVB784E?
    Answer: Some key features include high-performance processing, advanced memory interfaces, programmable I/Os, and integrated transceivers.

  3. Question: What applications can benefit from using the XCKU3P-L2SFVB784E?
    Answer: The XCKU3P-L2SFVB784E is commonly used in applications such as data center acceleration, wireless communication, video processing, and high-performance computing.

  4. Question: How many logic cells does the XCKU3P-L2SFVB784E have?
    Answer: The XCKU3P-L2SFVB784E has 2,586,240 logic cells.

  5. Question: What is the maximum number of transceivers supported by the XCKU3P-L2SFVB784E?
    Answer: The XCKU3P-L2SFVB784E supports up to 96 transceivers operating at various speeds.

  6. Question: Can the XCKU3P-L2SFVB784E be programmed using industry-standard design tools?
    Answer: Yes, the XCKU3P-L2SFVB784E can be programmed using Xilinx's Vivado Design Suite, which is an industry-standard tool for FPGA development.

  7. Question: What is the power consumption of the XCKU3P-L2SFVB784E?
    Answer: The power consumption of the XCKU3P-L2SFVB784E varies depending on the operating conditions, but it is designed to be power-efficient.

  8. Question: Does the XCKU3P-L2SFVB784E support high-speed memory interfaces?
    Answer: Yes, the XCKU3P-L2SFVB784E supports various high-speed memory interfaces such as DDR4, QDR IV, and RLDRAM 3.

  9. Question: Can the XCKU3P-L2SFVB784E be used in safety-critical applications?
    Answer: Yes, the XCKU3P-L2SFVB784E offers features like error correction codes (ECC) and built-in self-test (BIST), making it suitable for safety-critical applications.

  10. Question: Are there any development boards available for prototyping with the XCKU3P-L2SFVB784E?
    Answer: Yes, Xilinx provides development boards like the KCU105 and VCU118 that are compatible with the XCKU3P-L2SFVB784E for prototyping and evaluation purposes.

Please note that the answers provided here are general and may vary based on specific requirements and use cases.