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XCKU3P-2SFVB784I
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XCKU3P-2SFVB784I

Product Overview

Category

The XCKU3P-2SFVB784I belongs to the category of Field Programmable Gate Arrays (FPGAs).

Use

This FPGA is designed for high-performance computing and advanced digital signal processing applications.

Characteristics

  • High-speed processing capabilities
  • Large capacity for complex designs
  • Flexible reprogrammability
  • Low power consumption
  • High reliability

Package

The XCKU3P-2SFVB784I comes in a compact package, suitable for integration into various electronic systems.

Essence

The essence of this FPGA lies in its ability to provide customizable hardware solutions for a wide range of applications.

Packaging/Quantity

Each XCKU3P-2SFVB784I unit is packaged individually and is available in single quantities.

Specifications

  • Logic Cells: 2,500,000
  • DSP Slices: 1,920
  • Block RAM: 38,400 Kb
  • Maximum I/O Pins: 784
  • Operating Voltage: 1.0V
  • Operating Temperature Range: -40°C to 100°C
  • Package Type: Flip-Chip Ball Grid Array (FBGA)
  • Package Dimensions: 35mm x 35mm

Detailed Pin Configuration

For a detailed pin configuration diagram, please refer to the manufacturer's datasheet or technical documentation.

Functional Features

  • High-speed data processing
  • Parallel processing capabilities
  • On-chip memory resources
  • Configurable I/O interfaces
  • Built-in DSP blocks for efficient signal processing
  • Support for various communication protocols

Advantages and Disadvantages

Advantages

  • Versatile and flexible design options
  • High performance and processing capabilities
  • Low power consumption compared to alternative solutions
  • Reliable and durable construction
  • Wide range of available resources and interfaces

Disadvantages

  • Steep learning curve for beginners
  • Higher cost compared to traditional microcontrollers
  • Requires specialized design tools and expertise

Working Principles

The XCKU3P-2SFVB784I operates based on the principles of reconfigurable hardware. It consists of a matrix of programmable logic cells interconnected by configurable routing resources. The user can program the FPGA to implement custom digital circuits, enabling the device to perform specific tasks efficiently.

Detailed Application Field Plans

The XCKU3P-2SFVB784I finds applications in various fields, including: 1. High-performance computing clusters 2. Digital signal processing systems 3. Aerospace and defense electronics 4. Communications infrastructure 5. Industrial automation and control systems 6. Medical imaging and diagnostics 7. Scientific research and data analysis

Detailed and Complete Alternative Models

  1. XCKU3P-1SFVB784I: Similar to XCKU3P-2SFVB784I but with reduced logic cell count.
  2. XCKU3P-3SFVB784I: Similar to XCKU3P-2SFVB784I but with increased logic cell count.
  3. XCKU2P-2SFVB784I: Lower-cost alternative with slightly reduced performance specifications.

These alternative models provide options for different budget and performance requirements while maintaining compatibility with the XCKU3P series.

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Sebutkan 10 pertanyaan dan jawaban umum terkait penerapan XCKU3P-2SFVB784I dalam solusi teknis

Sure! Here are 10 common questions and answers related to the application of XCKU3P-2SFVB784I in technical solutions:

  1. Question: What is the XCKU3P-2SFVB784I?
    Answer: The XCKU3P-2SFVB784I is a specific model of Xilinx's UltraScale+ FPGA family, designed for high-performance applications.

  2. Question: What are the key features of the XCKU3P-2SFVB784I?
    Answer: Some key features include a high logic density, advanced DSP capabilities, high-speed transceivers, and support for various I/O standards.

  3. Question: What are some typical applications for the XCKU3P-2SFVB784I?
    Answer: This FPGA is commonly used in areas such as data center acceleration, wireless communication, video processing, and high-performance computing.

  4. Question: What is the maximum logic capacity of the XCKU3P-2SFVB784I?
    Answer: The XCKU3P-2SFVB784I has a maximum logic capacity of 2.8 million system logic cells.

  5. Question: How many high-speed transceivers does this FPGA support?
    Answer: It supports up to 96 high-speed transceivers, which can operate at speeds up to 32.75 Gbps.

  6. Question: Can the XCKU3P-2SFVB784I interface with different I/O standards?
    Answer: Yes, it supports various I/O standards such as LVCMOS, LVDS, HSTL, SSTL, and more.

  7. Question: What development tools are available for programming the XCKU3P-2SFVB784I?
    Answer: Xilinx provides Vivado Design Suite, which includes tools for synthesis, implementation, and debugging of FPGA designs.

  8. Question: Can the XCKU3P-2SFVB784I be used in a multi-FPGA system?
    Answer: Yes, it supports various connectivity options like high-speed serial interfaces and inter-FPGA communication protocols.

  9. Question: What is the power consumption of the XCKU3P-2SFVB784I?
    Answer: The power consumption depends on the specific design and usage scenario, but it typically ranges from tens to hundreds of watts.

  10. Question: Are there any reference designs or application notes available for the XCKU3P-2SFVB784I?
    Answer: Yes, Xilinx provides a wide range of reference designs, application notes, and documentation to help users get started with this FPGA and implement their technical solutions effectively.

Please note that the answers provided here are general and may vary depending on the specific requirements and use cases of your technical solution.