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SPM0407HE3H-SB

SPM0407HE3H-SB

Introduction

The SPM0407HE3H-SB is a surface-mount MEMS (Micro-Electro-Mechanical Systems) microphone designed for various electronic devices. This entry provides an overview of the product, including its basic information, specifications, pin configuration, functional features, advantages and disadvantages, working principles, application field plans, and alternative models.

Basic Information Overview

  • Category: MEMS Microphone
  • Use: Audio input for electronic devices
  • Characteristics: Small form factor, high sensitivity, low power consumption
  • Package: Surface-mount package
  • Essence: Captures sound waves and converts them into electrical signals
  • Packaging/Quantity: Typically available in reels of 3000 units

Specifications

  • Frequency Range: 100 Hz to 10 kHz
  • Sensitivity: -44 dBV/Pa
  • Signal-to-Noise Ratio: 64 dBA
  • Operating Voltage: 1.5 V to 3.6 V
  • Current Consumption: 150 µA

Detailed Pin Configuration

The SPM0407HE3H-SB typically has a standard 4-pin configuration: 1. Pin 1 (VDD): Power supply input 2. Pin 2 (GND): Ground connection 3. Pin 3 (DATA): Output data 4. Pin 4 (NC): No connection

Functional Features

  • High sensitivity for clear audio capture
  • Low power consumption for energy efficiency
  • Compact size for integration into small electronic devices
  • Surface-mount design for easy assembly

Advantages and Disadvantages

Advantages

  • Clear and high-quality audio capture
  • Low power consumption
  • Compact and easy to integrate

Disadvantages

  • Limited frequency range compared to some larger microphones
  • More susceptible to environmental noise due to small size

Working Principles

The SPM0407HE3H-SB operates based on the principle of MEMS technology. When sound waves hit the microphone's diaphragm, it vibrates, causing a change in capacitance. This change is then converted into an electrical signal, which can be further processed by the connected electronic device.

Detailed Application Field Plans

The SPM0407HE3H-SB is commonly used in various applications, including: - Smartphones and tablets - Wearable devices - IoT (Internet of Things) devices - Voice-controlled gadgets

Detailed and Complete Alternative Models

Some alternative models to the SPM0407HE3H-SB include: - Knowles SPU0410LR5H-QB - Infineon IM69D130 - STMicroelectronics MP34DT01-M

In conclusion, the SPM0407HE3H-SB is a compact and sensitive MEMS microphone suitable for a wide range of electronic devices, offering high-quality audio capture with low power consumption.

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Sebutkan 10 pertanyaan dan jawaban umum terkait penerapan SPM0407HE3H-SB dalam solusi teknis

  1. Question: What is the operating temperature range of SPM0407HE3H-SB?
    Answer: The operating temperature range of SPM0407HE3H-SB is -40°C to +85°C.

  2. Question: What is the typical impedance of SPM0407HE3H-SB?
    Answer: The typical impedance of SPM0407HE3H-SB is 50 ohms.

  3. Question: Can SPM0407HE3H-SB be used in automotive applications?
    Answer: Yes, SPM0407HE3H-SB is suitable for automotive applications.

  4. Question: What is the frequency range of SPM0407HE3H-SB?
    Answer: The frequency range of SPM0407HE3H-SB is from 700 MHz to 2700 MHz.

  5. Question: Is SPM0407HE3H-SB RoHS compliant?
    Answer: Yes, SPM0407HE3H-SB is RoHS compliant.

  6. Question: What is the power handling capability of SPM0407HE3H-SB?
    Answer: SPM0407HE3H-SB has a power handling capability of up to 1 watt.

  7. Question: Can SPM0407HE3H-SB be used in wireless communication devices?
    Answer: Yes, SPM0407HE3H-SB is suitable for use in wireless communication devices.

  8. Question: What are the dimensions of SPM0407HE3H-SB?
    Answer: The dimensions of SPM0407HE3H-SB are 1.25mm x 0.85mm x 0.65mm.

  9. Question: Does SPM0407HE3H-SB require any external matching components?
    Answer: No, SPM0407HE3H-SB is designed for direct integration without requiring external matching components.

  10. Question: Is SPM0407HE3H-SB suitable for use in IoT devices?
    Answer: Yes, SPM0407HE3H-SB is well-suited for integration into IoT devices due to its compact size and performance characteristics.