IS43DR16160A-3DBI

Product Overview

Category: Integrated Circuit (IC)

Use: Memory module for electronic devices

Characteristics: - High-speed and low-power DDR3 SDRAM - 16-bit wide data I/O - Double Data Rate architecture - Clock frequency up to 800 MHz - Operating voltage of 1.5V - Available in BGA package - RoHS compliant

Package: Ball Grid Array (BGA)

Essence: The IS43DR16160A-3DBI is a high-performance memory chip designed for use in electronic devices that require fast and efficient data storage and retrieval.

Packaging/Quantity: The IS43DR16160A-3DBI is typically sold in reels or trays, with each reel or tray containing a specific quantity of chips. The exact packaging and quantity may vary depending on the supplier.

Specifications

• Memory Type: DDR3 SDRAM
• Organization: 16M words x 16 bits
• Clock Frequency: Up to 800 MHz
• Data Rate: Double Data Rate (DDR)
• Operating Voltage: 1.5V
• Interface: Parallel
• Package Type: BGA
• Pin Count: 96
• Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The IS43DR16160A-3DBI has a total of 96 pins arranged in a specific configuration. The pinout diagram below illustrates the detailed pin configuration:

Functional Features

• High-speed data transfer: The IS43DR16160A-3DBI supports a clock frequency of up to 800 MHz, allowing for fast and efficient data transfer.
• Low power consumption: Designed with low-power DDR3 SDRAM technology, the chip minimizes power consumption while maintaining high performance.
• Wide data I/O: The 16-bit wide data input/output allows for efficient data processing and storage.

Advantages and Disadvantages

Advantages: - High-speed operation - Low power consumption - Compact BGA package - Wide data I/O

Disadvantages: - Limited temperature range (-40°C to +85°C) - Requires specialized equipment for installation and replacement

Working Principles

The IS43DR16160A-3DBI operates based on the principles of DDR3 SDRAM technology. It utilizes a double data rate architecture, allowing data to be transferred on both the rising and falling edges of the clock signal. This enables higher data transfer rates compared to traditional single data rate memory modules.

Detailed Application Field Plans

The IS43DR16160A-3DBI is commonly used in various electronic devices that require high-speed and low-power memory, such as: - Mobile phones - Tablets - Digital cameras - Gaming consoles - Networking equipment

Detailed and Complete Alternative Models

1. IS43DR16128B-3DBL: Similar to the IS43DR16160A-3DBI, but with a lower capacity of 128M words x 16 bits.
2. IS43DR32320C-3DBR: Higher capacity variant with 32M words x 32 bits organization.
3. IS43DR64640D-3DCI: Double-sided module with 64M words x 64 bits organization.

These alternative models offer different capacities and pin configurations to suit specific application requirements.

In conclusion, the IS43DR16160A-3DBI is a high-performance DDR3 SDRAM memory chip designed for use in electronic devices that demand fast and efficient data storage. With its high-speed operation, low power consumption, and wide data I/O, it provides a reliable solution for various applications. However, it is important to consider the limited temperature range and the need for specialized equipment during installation and replacement.