EP3SL70F780I3N

Product Overview

• Category: Programmable Logic Device (PLD)
• Use: EP3SL70F780I3N is a high-performance PLD designed for various applications in the field of digital logic design and implementation.
• Characteristics: The device offers advanced features such as high-speed performance, low power consumption, and flexible programmability. It comes in a compact package with a wide range of I/O pins, making it suitable for complex digital circuit designs.
• Package: EP3SL70F780I3N is available in a 780-pin FineLine BGA package.
• Essence: The essence of EP3SL70F780I3N lies in its ability to provide designers with a versatile and efficient solution for implementing complex digital logic circuits.

Specifications

• Logic Elements: EP3SL70F780I3N consists of 70,000 logic elements, which can be configured to perform various logical functions.
• Memory: The device includes 4,608 Kbits of embedded memory, allowing for efficient storage and retrieval of data.
• Clock Networks: EP3SL70F780I3N features 12 global clock networks, enabling synchronous operation of different components within the circuit.
• I/O Pins: The device offers 622 I/O pins, providing ample connectivity options for interfacing with external devices.
• Operating Voltage: EP3SL70F780I3N operates at a voltage range of 1.2V to 1.5V, ensuring compatibility with various power supply systems.
• Speed Grade: The device is available in multiple speed grades, with the highest grade offering a maximum operating frequency of 550 MHz.

Pin Configuration

The detailed pin configuration of EP3SL70F780I3N can be found in the datasheet provided by the manufacturer. It includes information about the function and connectivity of each pin, allowing designers to effectively integrate the device into their circuit designs.

Functional Features

• Flexible Programmability: EP3SL70F780I3N can be programmed using various hardware description languages (HDLs) such as VHDL or Verilog, enabling designers to implement custom logic functions.
• High-Speed Performance: The device offers fast propagation delays and high operating frequencies, making it suitable for applications that require real-time processing.
• Low Power Consumption: EP3SL70F780I3N incorporates power-saving features, allowing for efficient utilization of energy resources.
• Ample I/O Connectivity: With a large number of I/O pins, the device provides extensive options for interfacing with external devices and peripherals.

Advantages and Disadvantages

Advantages: - High-performance capabilities - Flexible programmability - Ample I/O connectivity - Low power consumption

Disadvantages: - Complex pin configuration may require careful planning during circuit design - Higher cost compared to simpler PLDs

Working Principles

EP3SL70F780I3N operates based on the principles of field-programmable gate arrays (FPGAs). It consists of configurable logic blocks (CLBs), interconnect resources, memory elements, and I/O buffers. The CLBs can be programmed to perform specific logical functions, while the interconnect resources facilitate communication between different components within the device. The memory elements allow for storage and retrieval of data, and the I/O buffers enable communication with external devices.

Application Field Plans

EP3SL70F780I3N finds applications in various fields, including but not limited to: - Digital signal processing - Communication systems - Industrial automation - Robotics - Aerospace and defense

The device's high-performance capabilities, flexible programmability, and ample I/O connectivity make it suitable for complex applications that require efficient digital logic implementation.

Alternative Models

• EP3SL110F780I3N: A higher-capacity version of the same PLD, offering 110,000 logic elements.
• EP3SL50F484I3N: A lower-capacity version with 50,000 logic elements, suitable for less complex designs.
• EP3SL150F1152I3N: A higher-capacity model with 150,000 logic elements, catering to more demanding applications.

These alternative models provide designers with options based on their specific requirements and project complexity.

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