Gambar mungkin merupakan representasi.
Lihat spesifikasi untuk detail produk.
IDT71V256SA10PZ

IDT71V256SA10PZ

Product Overview

Category

The IDT71V256SA10PZ belongs to the category of Static Random Access Memory (SRAM) chips.

Use

This product is primarily used as a high-speed, low-power memory solution in various electronic devices and systems.

Characteristics

  • High-speed operation: The IDT71V256SA10PZ offers fast access times, allowing for efficient data retrieval.
  • Low power consumption: This SRAM chip is designed to minimize power usage, making it suitable for battery-powered devices.
  • Large storage capacity: With a capacity of 256 kilobits, this chip can store a significant amount of data.
  • Reliable performance: The IDT71V256SA10PZ ensures stable and consistent operation, providing reliable data storage and retrieval.

Package

The IDT71V256SA10PZ is available in a compact and industry-standard 32-pin plastic package.

Essence

This SRAM chip serves as a crucial component in electronic systems, enabling rapid and reliable data storage and retrieval.

Packaging/Quantity

The IDT71V256SA10PZ is typically packaged in reels or trays, with each package containing a specified quantity of chips. The exact quantity may vary depending on the manufacturer's specifications.

Specifications

  • Organization: 32K x 8 bits
  • Supply voltage: 3.3V
  • Access time: 10 ns
  • Operating temperature range: -40°C to +85°C
  • Standby current: 10 μA (typical)
  • Package dimensions: 14mm x 8.65mm x 2.4mm

Detailed Pin Configuration

The IDT71V256SA10PZ features a 32-pin configuration. Here is a detailed pinout description:

  1. Chip Enable (CE)
  2. Output Enable (OE)
  3. Write Enable (WE)
  4. Address Inputs (A0-A14)
  5. Data Inputs/Outputs (DQ0-DQ7)
  6. Power Supply (+3.3V)
  7. Ground (GND)

Functional Features

  • Chip Enable (CE): Activates the chip for read/write operations.
  • Output Enable (OE): Enables the output buffers, allowing data to be read from the chip.
  • Write Enable (WE): Enables write operations to the chip.
  • Address Inputs (A0-A14): Selects the memory location for read/write operations.
  • Data Inputs/Outputs (DQ0-DQ7): Transfers data between the chip and external devices.
  • Power Supply (+3.3V): Provides the necessary power for the chip's operation.
  • Ground (GND): Serves as the reference voltage for the chip.

Advantages and Disadvantages

Advantages

  • High-speed operation enables efficient data access.
  • Low power consumption prolongs battery life in portable devices.
  • Large storage capacity accommodates a significant amount of data.
  • Reliable performance ensures consistent data storage and retrieval.

Disadvantages

  • Limited storage capacity compared to other memory technologies like NAND flash.
  • Relatively higher cost per bit compared to alternative memory solutions.

Working Principles

The IDT71V256SA10PZ operates based on the principles of static random access memory. It stores data using flip-flops, which retain information as long as power is supplied. The chip utilizes address inputs to select specific memory locations and allows data to be read or written through control signals. The high-speed operation is achieved by utilizing advanced circuitry and optimized design techniques.

Detailed Application Field Plans

The IDT71V256SA10PZ finds applications in various electronic systems, including but not limited to: 1. Computer systems: Used as cache memory to enhance overall system performance. 2. Networking equipment: Enables fast data buffering and packet processing. 3. Telecommunications devices: Facilitates quick data storage and retrieval in communication systems. 4. Industrial control systems: Provides reliable and high-speed memory for process control applications. 5. Automotive electronics: Supports data storage requirements in automotive control units.

Detailed and Complete Alternative Models

  1. Cypress CY62128BLL-70SXI: 128K x 8 SRAM, 70 ns access time.
  2. Samsung K6R4016V1D-UI10: 64K x 16 SRAM, 10 ns access time.
  3. Micron MT45W8MW16BGX-701 WT: 8M x 16 SRAM, 10 ns access time.
  4. Renesas R1LV1616RSA-7SI#B0: 2M x 8 SRAM, 7 ns access time.
  5. ISSI IS61C256AH-20N: 32K x 8 SRAM, 20 ns access time.

These alternative

Sebutkan 10 pertanyaan dan jawaban umum terkait penerapan IDT71V256SA10PZ dalam solusi teknis

Sure! Here are 10 common questions and answers related to the application of IDT71V256SA10PZ in technical solutions:

  1. Q: What is IDT71V256SA10PZ? A: IDT71V256SA10PZ is a 256K (32K x 8) high-speed CMOS static RAM (SRAM) with asynchronous operation.

  2. Q: What are the key features of IDT71V256SA10PZ? A: Some key features include a fast access time of 10ns, low power consumption, and a wide operating voltage range.

  3. Q: What is the typical application of IDT71V256SA10PZ? A: It is commonly used as a memory component in various electronic devices such as computers, routers, and embedded systems.

  4. Q: How does IDT71V256SA10PZ connect to other components in a system? A: It can be connected to a microcontroller or a processor through its address, data, and control lines.

  5. Q: Can IDT71V256SA10PZ be used in battery-powered devices? A: Yes, it has a low power consumption feature which makes it suitable for battery-powered applications.

  6. Q: What is the maximum operating frequency of IDT71V256SA10PZ? A: The maximum operating frequency is typically around 100MHz.

  7. Q: Does IDT71V256SA10PZ support multiple read/write operations simultaneously? A: No, it is an asynchronous SRAM and can only perform one read or write operation at a time.

  8. Q: What is the operating temperature range of IDT71V256SA10PZ? A: It can operate within a temperature range of -40°C to +85°C.

  9. Q: Can IDT71V256SA10PZ be used in high-reliability applications? A: Yes, it is designed to meet the requirements of various industrial and automotive applications.

  10. Q: Are there any specific precautions to consider when using IDT71V256SA10PZ? A: It is important to follow the recommended operating conditions and handle the device according to ESD protection guidelines to prevent damage.

Please note that these answers are general and may vary depending on the specific application and requirements.