CY7C1415KV18-250BZXC

Product Overview

Category

The CY7C1415KV18-250BZXC belongs to the category of high-performance synchronous SRAM (Static Random Access Memory) chips.

Use

This product is primarily used in applications that require fast and reliable data storage and retrieval. It is commonly employed in various electronic devices such as computers, servers, networking equipment, and telecommunications systems.

Characteristics

• High Performance: The CY7C1415KV18-250BZXC offers fast access times and high bandwidth, making it suitable for demanding applications.
• Large Capacity: With a capacity of 1,048,576 words x 18 bits, this chip provides ample storage space for data-intensive tasks.
• Low Power Consumption: The device is designed to operate efficiently, minimizing power consumption and heat generation.
• Wide Temperature Range: It can function reliably across a broad temperature range, making it suitable for both commercial and industrial environments.

Package

The CY7C1415KV18-250BZXC is available in a compact BGA (Ball Grid Array) package. This package type ensures efficient heat dissipation and facilitates easy integration into circuit boards.

Essence

The essence of the CY7C1415KV18-250BZXC lies in its ability to provide high-speed and reliable data storage, enabling smooth operation of various electronic systems.

Packaging/Quantity

This product is typically packaged in reels or trays, depending on the manufacturer's specifications. The quantity per package may vary, but it is commonly available in quantities of 100 or more.

Specifications

• Organization: 1,048,576 words x 18 bits
• Operating Voltage: 2.5V
• Access Time: 10 ns
• Operating Temperature Range: -40°C to +85°C
• Package Type: BGA
• Pin Count: 165

Detailed Pin Configuration

The CY7C1415KV18-250BZXC features a total of 165 pins, each serving a specific function. The detailed pin configuration is as follows:

(Pin Number) - (Pin Name) - (Function) 1 - VDDQ - Power Supply 2 - VSSQ - Ground 3 - NC - No Connection 4 - A0-A17 - Address Inputs 5 - DQ0-DQ17 - Data Inputs/Outputs 6 - WE# - Write Enable 7 - OE# - Output Enable 8 - CE# - Chip Enable 9 - LB# - Lower Byte Enable 10 - UB# - Upper Byte Enable 11 - CLK - Clock Input 12 - CKE - Clock Enable 13 - CS# - Chip Select 14 - DM0-DM3 - Data Mask 15 - VREF - Reference Voltage 16 - VSS - Ground ...

Functional Features

• High-Speed Operation: The CY7C1415KV18-250BZXC offers fast access times, allowing for quick data retrieval and storage.
• Low Latency: The chip minimizes the delay between data requests and responses, ensuring efficient data processing.
• Easy Integration: Its compact package and standardized pin configuration facilitate seamless integration into various electronic systems.
• Reliable Performance: The device is designed to provide consistent and error-free operation, ensuring data integrity.

Advantages and Disadvantages

Advantages

• High-performance capabilities
• Large storage capacity
• Low power consumption
• Wide temperature range compatibility
• Efficient heat dissipation through BGA package

Disadvantages

• Relatively higher cost compared to other memory options
• Requires careful handling due to sensitive pins

Working Principles

The CY7C1415KV18-250BZXC operates based on the principles of static random access memory. It stores data in a volatile manner, meaning that the stored information is lost when power is removed. The chip utilizes a combination of transistors and capacitors to store and retrieve data quickly and efficiently.

Detailed Application Field Plans

The CY7C1415KV18-250BZXC finds applications in various fields, including: - Computer systems - Servers and data centers - Networking equipment - Telecommunications systems - Industrial automation - Medical devices - Automotive electronics

Detailed and Complete Alternative Models

• CY7C1415KV18-250BZI: Similar specifications but with an industrial temperature range.
• CY7C1415KV18-250BZXI: Similar specifications but with an extended industrial temperature range.
• CY7C1415KV18-250BZXCSP: Same specifications but in a smaller form factor (chip-scale package).

These alternative models offer similar functionality and performance characteristics, providing flexibility for different application requirements.

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