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CN5179 BK TIN/LEAD

CN5179 BK TIN/LEAD

Product Overview

Category

CN5179 BK TIN/LEAD belongs to the category of soldering materials.

Use

It is used for electronic soldering applications, such as circuit board assembly and repair.

Characteristics

  • Melting Point: 183°C - 190°C
  • Good wetting properties
  • Reliable joint strength
  • Suitable for both manual and automated soldering processes

Package

The product is available in the form of solder wire or solder bar, packaged in airtight containers to prevent oxidation.

Essence

CN5179 BK TIN/LEAD is essential for creating strong and reliable electrical connections in electronic devices.

Packaging/Quantity

The product is typically available in spools or reels for solder wire, and in bundles for solder bars. The quantity varies based on the package size, ranging from 100g to 1kg.

Specifications

  • Alloy Composition: Tin (Sn) and Lead (Pb)
  • Flux Core: Rosin-based or no-clean flux
  • Diameter: 0.5mm - 3.0mm (for solder wire)
  • Length: Varies based on package
  • Appearance: Shiny, metallic finish

Detailed Pin Configuration

N/A (Not applicable for this product)

Functional Features

  • Excellent thermal conductivity
  • Low tendency for tin whisker formation
  • Minimal spattering during soldering
  • Compatible with various surface finishes including HASL, ENIG, and OSP

Advantages

  • Versatile and suitable for a wide range of electronic components
  • Consistent and reliable solder joint formation
  • Good flow characteristics during soldering
  • Long shelf life when stored properly

Disadvantages

  • Contains lead, which may pose health and environmental risks if not handled and disposed of properly
  • Not suitable for applications requiring lead-free soldering

Working Principles

CN5179 BK TIN/LEAD works by melting the solder alloy to create a metallurgical bond between the electronic components and the circuit board. The flux core helps remove oxides and contaminants, promoting proper wetting and adhesion.

Detailed Application Field Plans

This soldering material is commonly used in the following application fields: - Consumer electronics manufacturing - Automotive electronics - Telecommunications equipment - Industrial control systems - Medical devices

Detailed and Complete Alternative Models

  • SAC305 (Lead-free alternative)
  • SN63/PB37 (Eutectic solder alloy)
  • SN60/PB40 (High-lead solder alloy)

In conclusion, CN5179 BK TIN/LEAD is a reliable soldering material with excellent wetting properties and joint strength, making it suitable for various electronic soldering applications. However, its use requires careful handling and disposal due to the presence of lead. Alternative models are available for lead-free and specific application requirements.

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Sebutkan 10 pertanyaan dan jawaban umum terkait penerapan CN5179 BK TIN/LEAD dalam solusi teknis

  1. What is CN5179 BK TIN/LEAD used for?

    • CN5179 BK TIN/LEAD is commonly used as a soldering material in electronic assembly and manufacturing processes.
  2. What are the key properties of CN5179 BK TIN/LEAD?

    • CN5179 BK TIN/LEAD exhibits good wetting, low melting point, and excellent solderability, making it suitable for various technical solutions.
  3. Is CN5179 BK TIN/LEAD compliant with environmental regulations?

    • CN5179 BK TIN/LEAD may contain lead, so it's important to ensure compliance with relevant environmental regulations and directives.
  4. What are the recommended application methods for CN5179 BK TIN/LEAD?

    • CN5179 BK TIN/LEAD can be applied using wave soldering, reflow soldering, or hand soldering techniques, depending on the specific requirements of the technical solution.
  5. Does CN5179 BK TIN/LEAD require any special handling or storage conditions?

    • Yes, CN5179 BK TIN/LEAD should be stored in a cool, dry place and handled in accordance with safety guidelines to prevent exposure to fumes or ingestion.
  6. Are there any known compatibility issues with CN5179 BK TIN/LEAD and other materials?

    • It's important to consider compatibility with substrates, coatings, and components when using CN5179 BK TIN/LEAD to avoid potential issues such as solder joint reliability or corrosion.
  7. What are the typical applications where CN5179 BK TIN/LEAD is used?

    • CN5179 BK TIN/LEAD is commonly used in applications such as printed circuit board (PCB) assembly, electrical connections, and general soldering in electronic devices.
  8. What safety precautions should be taken when working with CN5179 BK TIN/LEAD?

    • Safety measures such as proper ventilation, personal protective equipment (PPE), and adherence to handling guidelines should be followed to minimize exposure to lead and other potential hazards.
  9. Can CN5179 BK TIN/LEAD be used in high-temperature environments?

    • CN5179 BK TIN/LEAD has a relatively low melting point, so it may not be suitable for applications that involve sustained high temperatures.
  10. Are there alternative lead-free options to CN5179 BK TIN/LEAD?

    • Yes, there are lead-free solder alloys available as alternatives to CN5179 BK TIN/LEAD, which may be preferred in certain applications due to environmental and regulatory considerations.