Alliance Memory, Inc.
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AS4C256M16D3L-12BIN
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AS4C256M16D3L-12BIN

Basic Information Overview

  • Category: Integrated Circuit (IC)
  • Use: Memory module
  • Characteristics:
    • High-speed performance
    • Low power consumption
    • Large storage capacity
  • Package: BGA (Ball Grid Array)
  • Essence: Dynamic Random Access Memory (DRAM)
  • Packaging/Quantity: Bulk packaging, quantity varies

Specifications

  • Part Number: AS4C256M16D3L-12BIN
  • Organization: 256 Megabit x 16
  • Speed: 1200 MHz
  • Voltage: 1.35V
  • Operating Temperature Range: -40°C to +85°C
  • Data Rate: DDR3L
  • Interface: Parallel
  • Pin Count: 96

Detailed Pin Configuration

The AS4C256M16D3L-12BIN has a total of 96 pins. The pin configuration is as follows:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VDD | Power supply voltage | | 2 | VSS | Ground | | 3 | DQ0 | Data input/output bit 0 | | 4 | DQ1 | Data input/output bit 1 | | ... | ... | ... | | 95 | DQ14 | Data input/output bit 14 | | 96 | DQ15 | Data input/output bit 15 |

Functional Features

  • High-speed data transfer
  • Non-volatile storage
  • Error correction capabilities
  • Self-refresh mode for power-saving

Advantages and Disadvantages

Advantages: - High-speed performance allows for faster data access - Low power consumption helps in reducing energy usage - Large storage capacity enables storing large amounts of data

Disadvantages: - Relatively higher cost compared to other memory modules - Limited compatibility with older systems

Working Principles

The AS4C256M16D3L-12BIN is based on the dynamic random access memory (DRAM) technology. It stores data in capacitors within each memory cell, which needs to be periodically refreshed to maintain the stored information. The memory cells are organized in a matrix, and data is accessed by selecting the appropriate row and column addresses.

Detailed Application Field Plans

The AS4C256M16D3L-12BIN is commonly used in various electronic devices and systems that require high-speed and large-capacity memory. Some application fields include: - Personal computers - Servers - Networking equipment - Gaming consoles - Industrial automation systems

Detailed and Complete Alternative Models

  • AS4C256M16D3L-12BCN
  • AS4C256M16D3L-12BCN-T
  • AS4C256M16D3L-12BCN-TR
  • AS4C256M16D3L-12BCN-TS
  • AS4C256M16D3L-12BCN-TS2

These alternative models offer similar specifications and functionality as the AS4C256M16D3L-12BIN, providing options for different sourcing and availability.

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Sebutkan 10 pertanyaan dan jawaban umum terkait penerapan AS4C256M16D3L-12BIN dalam solusi teknis

Sure! Here are 10 common questions and answers related to the application of AS4C256M16D3L-12BIN in technical solutions:

  1. Q: What is the AS4C256M16D3L-12BIN? A: The AS4C256M16D3L-12BIN is a specific model of DDR3 SDRAM memory module.

  2. Q: What is the capacity of the AS4C256M16D3L-12BIN? A: The AS4C256M16D3L-12BIN has a capacity of 4 gigabits (Gb), which is equivalent to 512 megabytes (MB).

  3. Q: What is the speed rating of the AS4C256M16D3L-12BIN? A: The AS4C256M16D3L-12BIN has a speed rating of 12 nanoseconds (ns).

  4. Q: What is the voltage requirement for the AS4C256M16D3L-12BIN? A: The AS4C256M16D3L-12BIN operates at a voltage of 1.5 volts (V).

  5. Q: Can the AS4C256M16D3L-12BIN be used in laptops or desktop computers? A: Yes, the AS4C256M16D3L-12BIN can be used in both laptops and desktop computers, as long as they support DDR3 SDRAM.

  6. Q: Is the AS4C256M16D3L-12BIN compatible with other memory modules? A: Yes, the AS4C256M16D3L-12BIN is compatible with other DDR3 SDRAM memory modules, as long as they have the same specifications.

  7. Q: What are the typical applications of the AS4C256M16D3L-12BIN? A: The AS4C256M16D3L-12BIN is commonly used in various technical solutions, such as servers, workstations, and high-performance computing systems.

  8. Q: Can the AS4C256M16D3L-12BIN be overclocked for higher performance? A: Overclocking the AS4C256M16D3L-12BIN is possible, but it may void the warranty and can potentially lead to instability or damage if not done properly.

  9. Q: Does the AS4C256M16D3L-12BIN support error correction (ECC)? A: No, the AS4C256M16D3L-12BIN does not support error correction. It is a non-ECC memory module.

  10. Q: Where can I purchase the AS4C256M16D3L-12BIN? A: The AS4C256M16D3L-12BIN can be purchased from various electronics suppliers, both online and offline.