AS4C128M16D3-12BCN

Product Overview

Category

AS4C128M16D3-12BCN belongs to the category of dynamic random-access memory (DRAM) modules.

Use

It is primarily used as a main memory component in various electronic devices such as computers, servers, and embedded systems.

Characteristics

• High-speed data access and retrieval capabilities
• Volatile memory that requires constant power supply
• Large storage capacity
• Compact form factor
• Compatible with industry-standard interfaces

Package

AS4C128M16D3-12BCN is packaged in a small outline dual in-line memory module (SODIMM) format. This package type allows for easy installation and removal in compatible devices.

Essence

The essence of AS4C128M16D3-12BCN lies in its ability to store and retrieve data quickly, making it an essential component for efficient computing and data processing.

Packaging/Quantity

AS4C128M16D3-12BCN is typically sold in individual units or in bulk packaging, depending on the requirements of the customer. The quantity may vary based on the specific needs of the buyer.

Specifications

• Model: AS4C128M16D3-12BCN
• Memory Type: DDR3 SDRAM
• Capacity: 2GB (128 Meg x 16)
• Speed: 1200 MHz
• Voltage: 1.5V
• CAS Latency: 12
• Organization: 128M words x 16 bits
• Interface: 240-pin SODIMM
• Operating Temperature: 0°C to 85°C

Detailed Pin Configuration

The pin configuration of AS4C128M16D3-12BCN is as follows:

Pin 1: VDD Pin 2: DQ0 Pin 3: DQ1 ... Pin 238: VSS Pin 239: NC Pin 240: VDDSPD

Functional Features

• High-speed data transfer rate for improved system performance
• Low power consumption for energy efficiency
• Error correction capabilities for enhanced reliability
• Support for advanced memory management features
• Compatibility with various operating systems and platforms

Advantages and Disadvantages

Advantages

• Fast data access and retrieval speeds
• Large storage capacity
• Compact form factor for easy integration into devices
• Compatible with industry-standard interfaces
• Error correction capabilities for improved reliability

Disadvantages

• Volatile memory requires constant power supply
• Relatively higher cost compared to other memory technologies
• Limited lifespan due to the finite number of read/write cycles

Working Principles

AS4C128M16D3-12BCN operates based on the principles of dynamic random-access memory. It stores data in a matrix of capacitors, where each capacitor represents a single bit of information. To read or write data, electrical charges are applied to the appropriate capacitors, allowing for the storage or retrieval of information.

Detailed Application Field Plans

AS4C128M16D3-12BCN finds applications in various fields, including:

1. Personal Computers: Used as main memory in desktops and laptops.
2. Servers: Provides high-speed memory for data processing and storage in server environments.
3. Embedded Systems: Used in embedded devices such as industrial control systems, medical equipment, and automotive electronics.

Detailed and Complete Alternative Models

Some alternative models to AS4C128M16D3-12BCN include:

1. AS4C256M16D3-12BCN: Higher capacity variant with 4GB (256 Meg x 16) memory.
2. AS4C64M16D3-12BCN: Lower capacity variant with 1GB (64 Meg x 16) memory.
3. AS4C128M8D3-12BCN: Variant with the same capacity but organized as 128M words x 8 bits.

These alternative models offer different capacities and organization options to suit specific requirements.

In conclusion, AS4C128M16D3-12BCN is a dynamic random-access memory module that provides high-speed data access and storage capabilities. It is widely used in various electronic devices and offers advantages such as fast performance, large capacity, and compatibility with industry standards. However, it also has limitations such as volatility and limited lifespan. Understanding its specifications, pin configuration, functional features, and application field plans can help users make informed decisions when selecting memory modules for their devices.